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[Compgeom-announce] CFP: 12th ACM Solid and Physical Modeling Symposium


       12th ACM Solid and Physical Modeling Symposium

      http://cg.cs.tsinghua.edu.cn/spm2007/cfp.htm



           Tsinghua University, Beijing
                   4-6th June 2007

Since its inception in 1991, the ACM Symposium on Solid Modeling
and Applications has been the primary venue for disseminating
research results in the design, representation, analysis,
visualization, and use of digital models of real or planned solid
objects and their bounding surfaces. Actually, solid modeling entails
not only modeling their geometric shape, but also their physical
properties and behaviors. To emphasize this broader mission, the
name of the Symposium was expanded to Solid and Physical Modeling
(SPM) in 2005. SPM seeks submissions from academic, industrial and
government researchers that present new results regarding the analysis,
simulation, modeling, and animation of the behavior of objects; and
the properties of objects as functions of space and time in response
to interactions with human users, operators or the physical environment.

Conference Topics

Topics of interest include, but are not limited to:
   * Biomedical applications
   * Curves and surfaces
   * Dimensioning, tolerancing and constraints
   * Geo-scientific applications and oil exploration
   * Interaction and virtual environment
   * Mesh processing
   * Physically based modeling
   * Product data standards and interoperability
   * Reverse engineering
   * Shape analysis
   * Simulation

Invited Speakers
   * Herbert Edelsbrunner, Duke University, USA
   * Gershon Elber, Technion, Israel
°° * Shing-Tung Yau, Harvard University, USA

Pierre B®¶zier Prize

The first annual Pierre Bezier Prize will be awarded at ACM SPM 2007
for contributions to solid, shape and physical modeling.

UGS Best Paper Award

UGS Corporation are again very generously sponsoring prizes for the
best papers at the Symposium. Two best papers selected by a Prize
Committee will share the prize of US$3000.

Republication in Journals

Some papers of outstanding quality that have been presented at ACM
SPM 2007 will be selected for publication in an extended and revised
form in journals of Computer Aided Geometric Design, Computer Aided
Design and IEEE Transactions of Automation Science and Technology.

Important Dates

   * Abstracts due: November 1, 2006
   * Full papers due: November 15, 2006
   * Acceptance decisions: January 10, 2007
   * Final versions due: March 1, 2007

Information for Authors

The Proceedings will be published by ACM Press. More information about
paper submission and format templates will be available at
http://cg.cs.tsinghua.edu.cn/spm2007/.

Conference Organization

Honorary Conference Chairs
°°°°Chris Hoffmann, Purdue University, USA
°°°°Jia-Guang Sun, NSFC, China

Conference Co-Chairs:
°°°°Shi-Min Hu, Tsinghua?University, China
°°°°Hong Qin, Stony Brook University, USA

Program Co-Chairs:
   Bruno Levy, INRIA Loraine, France
   Dinesh Manocha, Univ. of North Carolina, USA

Program Committee Members:
   Pierre Alliez, INRIA, France
   Cecil Armstrong, Queen's University Belfast, UK
   Hujun Bao, Zhejiang University, China
   Alexander Belyaev, MPI, Germany
   George-Pierre Bonneau, GRAVIR-IMAG, France
   Oliver Brock, University of Massachusetts Amherst, USA
   Wim Bronsvoort, Delft University of Technology, The Netherlands
   Steven Cameron, Oxford University, UK
   Marie-Paule Cani, INP Grenoble, France, France
   Frederic Cazals, INRIA Geometrica, France
   Raphaelle Chaine, CNRS, France
   Falai Chen, Univ. of Science and Technology, China
   Fuhua (Frank) Cheng, University of Kentucky, USA
   Young Choi, Chung Ang University, Korea
   Danny Cohen-Or, Tel Aviv University, Isreal
   Elaine Cohen, University of Utah, USA
   Jonathan Corney, Heriot Watt University, UK
   Xavier Decoret, INRIA - ARTIS, France
   Leila De Floriani, University of Genova, Italy
   Tamal Dey, Ohio State University, USA
   Deba Dutta, University of Michigan, USA
   Ramsay Dyer, Simon Fraser University, Canada
   Herbert Edelsbrunner, Duke University, USA
   Gershon Elber, Technion, Israel
   Anath Fisher, Technion, Israel
   Craig Gotsman, Technion, Israel
   Xianfeng Gu, Stony Brook University, USA
   Baining Guo, Microsoft Research Asia, China
   Soon-Hung Han, KAIST, Korea
   Masuda Hiroshi, University of Tokyo, Japan
   Chris Hoffmann, Purdue University, USA
   Imre Horvath, Delft Univ. of Tech., The Netherlands
   Tao Ju, Washington University at St. Louis, USA
   Takashi Kanai, University of Tokyo, Japan
   David Kasik, Boeing, USA
   John Keyser, Texas A&M, USA
   Deok-Soo Kim, Hanyang University, South Korea
   Myung-Soo Kim, Seoul National Univ., South Korea
   Young Kim, Ewha University, South Korea
   Leif Kobbelt, RWTH Aachen, Germany
   Shankar Krishnan, AT&T Labs, USA
   Suresh Krishnan, University of Wisconsin, USA
   Jean-Claude Latombe, Stanford University, USA
   Kunwoo Lee, Seoul National University, South Korea
   Kwan-Haeng Lee, GIST, South Korea
   Andre Lieutier, Dassault, France
   Yong-Jin Liu, Tsinghua University, China
   Takashi Maekawa, Yokohama National Univ., Japan
   Ralph Martin, Cardiff University, UK
   Gopi Meenakshisundaram, UC Irvine, USA
   Miguel Otaduy, ETH-Zurich, Switzerland
   Nicholas Patrikalakis£¨MIT, USA
   Jorg Peters, University of Florida, USA
   Hartmut Prautzsch, Karlsruhe University, Germany
   Karthik Ramani, Purdue University, USA
   Ari Rappoport, Hebrew University of Jerusalem, Israel
   Stephane Redon, INRIA, France
   Bill Regli, Drexel University, USA
   Jarek Rossignac, Georgia Tech, USA
   Malcolm Sabin, Numerical Geometry, UK
   Hans-Peter Seidel, MPI, Germany
   Vadim Shapiro, University of Wisconsin, USA
   Alla Sheffer, University of British Columbia, Canada
   Kenji Shimada, Carnegie Mellon University, USA
   Hayong Shin, KAIST, Daejon, South Korea
   Ram Sriram, NIST, USA
   Neil Stewart, University of Montreal, Canada
   Avneesh Sud, University of North Carolina, USA
   Hiromasa Suzuki, Tokyo University, Japan
   Chiew-Lan Tai, Hong Kong Univ. of Science and Tech.
   Kai Tang, Hong Kong Univ. of Science and Technology
   Sivan Toledo, Tel-Aviv University, Isreal
   Nicolas Tsingos, INRIA-REVES, France
   George Turkiyyah, University of Washington, USA
   Jan H. Vandenbrande, Boeing, USA
   Amitabh Varshney, University of Maryland, USA
   Alvar Vinacua, Polytechnic Univ. of Catalunya, Spain
   Don Vossler, UGS Corp., USA
   Charlie C. L. Wang, Chinese University of Hong Kong
   Enhua Wu, Macau University, China
   Zongmin Wu, Fudan University, China
   Sungeui Yoon, Lawrence Livermore Labs, USA
   Jun-Hai Yong, Tsinghua University, China
   Michael Yu Wang, ChineseUniversity of Hong Kong
   Jovan Zagajac, Ford Motor Company, USA
   Cai-Ming Zhang, Shandong University, China
   Jianmin Zheng, Nanyang Technological Univ., Singapore
   Denis Zorin, New York University, USA

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