[compgeom-announce] Call for Participation: ACM Solid and Physical Modeling Symposium 2007

[Joe Mitchell <jsbm@ams.sunysb.edu>]

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Call-for-Participation

ACM Solid and Physical Modeling Symposium 2007

Tsinghua University, Beijing, China
June 4-6, 2007
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ACM Solid and Physical Modeling Symposium 2007 (SPM 2007) will be held
on June 4-6, 2007, at Tsinghua University, Beijing, China. This is the
first time ACM SPM will be held in Asia. In addition to SPM technical
program of paper and poster presentations, the Solid Modeling
Association will award the 2007 Pierre Bézier Prize for contributions
to solid, shape and physical modeling. The SPM Best Paper Award is
sponsored by UGS Corporation.

Invited speakers include

Herbert Edelsbrunner, Duke University, USA 

Gershon Elber, Technion, Israel 

Shing-Tung Yau (Fields Medal 1982), Harvard University, USA 
 
The conference details including the program and registration
information can be found at: http://cg.cs.tsinghua.edu.cn/spm2007

We warmly welcome researchers, practitioners, colleagues, and students
to attend SPM 2007 in Beijing. 

Honorary Conference Chairs

Chris Hoffmann, Purdue University, USA
Jia-Guang Sun, NSFC, China

Conference Co-Chairs:

Shi-Min Hu, Tsinghua University, China
Hong Qin, Stony Brook University, USA 

Program Co-Chairs:

Bruno Levy, INRIA Loraine, France
Dinesh Manocha, Univ. of North Carolina, USA



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